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Engineering and Construction
Pages 10 (2510 words)
HIGH DENSITY PLASMA CVD I start this article with the introduction to the Chemical vapor deposition (CVD). CVD is a chemical phenomenon of a material to deposit it on another material. This is done using thin films of the different materials. A typical CVD phenomenon includes the exposure of a material commonly in volatile format with the substrate which allows the reaction of those and obtains the desired result, deposit or exposure.
These include silicon, carbon, nitrites, carbides, oxides and also many others. In semi-conductor world, CVT is majorly used in the fabrication process of the semiconductor devices and to the exposure of the amorphous SiO2, Silicon Germanium and tungsten etc. The CVD is also the cause of the production of synthetic diamonds. The major importance of CVD in the industry lies in the fact that this process uses the gases as reactants. So the gas’s properties give much support to the reaction procedures. CVD is far most the best and reliable deposition phenomenon/process present. Its advantages include Versatile in nature – any element can be deposited either metallic or non-metallic About 99.99-99.999% pure results Formation of the material less than the melting point Nearly 100% density Economical There exist various types of Chemical Vapor Deposition. ...
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