The figure below shows the High Performance Lead Frame Electronic Package.
I selected the concept on the basis of its power management applications in the electronics engineering field. The leads in the extended area of the design increase current competence leading to required power rating. The electronic applications in the recent years find a reduction of per transistor power rate along with higher current and power rating accompanied by better performance and speed constraints. The lead frame technology keeps these requirements to much efficient position.
I have analyzed the various design considerations made in the electronics packaging sector in order to determine the actual and worth design for the potential package of electronic modules. It is known to all that the electronic package is not just outer coverings of component or assembly of components but the substrate, interconnections and covering are also included in it. The lead frame was made which comprises of a layer of conductor of electricity, a die paddle and a plurality of leads which are remote from each other and are partly bare at the base of the package. This provides a platform for fitting various components of the circuit to be built. The semiconductor chips include the bond pads which are mounted on the die plane interconnected by the wires between them and plurality of leads. There exists a minimum of two wires connected between a minimum of two bond pads and a plurality of leads with single lead. Each single lead has an extended portion required for higher performance.
My study of the electronic packaging techniques revealed that they have flourished from the primitive blown and shaped slip metal packaging to the trail assemblage in print. The electronics field determines the packaging as a significant area of engineering. The overall performance of a circuit assembly can be increased by utilizing ...
Cite this document
(“ELECTRONIC PACKAGING AND ASSEMBLY Lab Report Example | Topics and Well Written Essays - 1750 words”, n.d.)
Retrieved from https://studentshare.net/miscellaneous/381657-electronic-packaging-and-assembly
(ELECTRONIC PACKAGING AND ASSEMBLY Lab Report Example | Topics and Well Written Essays - 1750 Words)
“ELECTRONIC PACKAGING AND ASSEMBLY Lab Report Example | Topics and Well Written Essays - 1750 Words”, n.d. https://studentshare.net/miscellaneous/381657-electronic-packaging-and-assembly.
The Stethoscope is an auditory medical appliance for listening to internal resonance in human body which is referred to, in medical language, as auscultation. Heart sound vibration is one of the most essential ways to judge the condition of the cardiac function.
The apparatus used were as follows; patch-board, farnell low frequency (LF) oscillator, oscilloscope (CD 1400 including 1 off CX1 449), digital voltmeter and digital frequency meter. Procedure The LF oscillator was connected in series of a capacitor and a resistor and the voltage across and current through the capacitor measured at frequencies between 1 kHz and 10 kHz.
At the end of the supply chain the customer is ultimately the person that takes the packaged product into their homes or businesses. Designing packaging materials is a function that can add value to an
The LF oscillator was connected in series of a capacitor and a resistor and the voltage across and current through the capacitor measured at frequencies between 1 kHz and 10 kHz. Current was determined by
By the end of this lab, you should be able to analyse circuit behaviour when DC or AC voltages are applied to the circuits. You are required to record all activities (observations, results and comments) in your logbook as you
Voltage decays exponentially as the current flowing through the circuit grows exponentially to its maximum value. For series of equal time periods the inductor is charged to its maximum value of which the current value will never reach
The experiment was aimed at confirming this by building and testing various op-amp circuits that make use of negative feedback.
The circuits are mainly built of the operational amplifier integrated circuit, and forward and feedback
Design for assembly can be defined as the process of systematic analyses aimed at simplifying the structure of the product as well as reducing the products assembly cost. The assembly quality of the product is associated with the number of parts. The DFA technique can enable the rating of the assimilability by the designers quantitatively.
4 Pages(1000 words)Lab Report
GOT A TRICKY QUESTION? RECEIVE AN ANSWER FROM STUDENTS LIKE YOU!
Let us find you another Lab Report on topic ELECTRONIC PACKAGING AND ASSEMBLY for FREE!