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High Aspect Ratio Photolithography for MEMS Application
Engineering and Construction
Pages 3 (753 words)
High-aspect-Ratio photolithography for MEMS application In microstructure photography, there are limitations in the resolution that can be achieved by some conventional photolithography methods, due to the expense involved or the limitation of the setup in equipment.
Review There are several methods that have been used in photolithography and fabrication of molds for use in metal microstructures. LIGA is one of the most common methods that have been previously used for this purpose; this approach has some advantages in that it can be used with tall microstructures that ranged from 100µm to 1mm. The effectiveness of this method is that it has no effect on the lateral dimensional accuracy of the long microstructures making it a versatile method, and this explains why it is popular among other photolithographic methods. The limitation of this method is that fabrication of LIGA involves a considerably high cost, and lack of an x-ray synchronized source that would give hard x-rays of high intensity and with low divergent properties. Reactive Ion Etching (RIE) s another method that involves polyamide, which is sued to fabricate low cost high aspect ratio structures as compared to LIGA above. With this process, a thickness of 100µm is achieved with the aspect ratio being 10. The limitation of this process is the tediousness of modifying the RIE machine. ...
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